I am trying to simulate an electronics chassis sitting on a table in a lab. Each chassis side panel has 2 sets of pin clusters with a fan impinging on each pin cluster. This is not really a natural convection problem, but it is not really a wind tunnel-type forced convection problem either, in the sense of air moving over the chassis from front to back.
I created an air environment around the chassis, but it was either too small or I did not assign boundary conditions properly. I assigned p=0 and T=55C boundary conditions to the top surface, but after a few iterations with Heat Transfer enabled the entire air volume was heating up significantly, except for the top surface of the air volume which was still at 55 C.
So I am not sure the chassis temperatures I am getting are true since the air is not constant at 55 C. Should I have assigned T=55 C to all air volume surfaces? Or do I need to make the air volume larger?
I have attached 2 .jpeg files for reference.
![Autodesk Design & Make Report](https://forums.autodesk.com/t5/image/serverpage/image-id/1350519iCB55845EBFC43016/image-size/large?v=v2&px=999" "Autodesk Design & Make Report")