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05-13-2013
06:37 AM
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I have a PCB with a component rejecting ~20W of thermal power. The component itself is ~1 inch Wide X 1 inch long X0.1 inch thick which I am trying to cool.
How does one apply "internal heat generation" for heat transfer studies? Since the unit for internal heat generation is Heat rate/volume, I am confused as to how do I apply this to my processor. Dividing 20W by the volume of the component gives a strange number that I am not sure is right.
Can someone clarify please?
thanks
Jay
ADESK Algor 2010
Solved! Go to Solution.
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